KIOXIA America, Inc. today announced that it has begun shipping evaluation samples 1 of embedded flash memory compatible with the next-generation UFS standard, UFS 5.0, which is currently being ...

AI’s hunger for memory has finally spilled out of the data center and into the living room, turning what used to be a cheap PC upgrade into one of the most painful line items on a build sheet. The ...

JEDEC’s HBM4 and the emerging SPHBM4 standard boost bandwidth and expand packaging options, helping AI and HPC systems push past the memory and I/O walls.

Major technology firms are betting big on AI, creating huge demand for hardware, software, and services that underpin this massive, burgeoning market. That includes Qualcomm, which is rolling out new ...

When Google recently announced plans to build three new data centers in Texas to support its expanding AI workloads, more attention was paid to the eye-watering $40 billion price tag than to the ...

KIOXIA America, Inc. today announced that it has begun sampling 1 new Universal Flash Storage 2 (UFS) Ver. 4.1 embedded memory devices with 4-bit-per-cell, quadruple-level cell (QLC) technology.

The debut of DeepSeek R1 sent ripples through the AI community, not just for its capabilities, but also for the sheer scale of its development. The 671-billion-parameter, open-source language model’s ...

Congatec’s lineup includes five embedded board variants that support several memory standards, such as LPDDR5X, DDR5 SO-DIMM, ...

TOKYO--(BUSINESS WIRE)--Kioxia Corporation, a world leader in memory solutions, today announced that it has begun sampling new Universal Flash Storage 1 (UFS) Ver. 4.1 embedded memory devices with ...