Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...
Accurate measurement results depend on regular microscope calibration to ensure consistency and reliability across scientific and industrial use.
Automated DIC imaging with the DM6 M microscope enhances six-inch wafer inspection, providing reproducible results and improved efficiency for defect analysis.
Defect inspection scientists from Huazhong University of Science and Technology, Harbin Institute of Technology and The Chinese University of Hong Kong make a thorough review of new perspectives and ...
A new technical paper titled “Electron Microscopy-based Automatic Defect Inspection for Semiconductor Manufacturing: A Systematic Review” was published by researchers at KU Leuven and imec. “In this ...
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